Hi,
I'm newbie in reball, so pls forgive me if technical words I use are wrong.
What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where the pad lifted after BGA been melted 2-3 times due to misalignment of new solder balls.
My procedure of reball as below:
1. Bake the BGA at 125 deg C
2. Remove bad solder balls manually using soldering iron with solder wick
3. Place new solder balls
4. Reflow (I'm using hot plate to melt the balls due to limited space, so BGA might experienced sudden change of temperature from room temp to high temp)
5. Inspection
Any feedback would be appreciated. Thanks.
I'm newbie in reball, so pls forgive me if technical words I use are wrong.
What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where the pad lifted after BGA been melted 2-3 times due to misalignment of new solder balls.
My procedure of reball as below:
1. Bake the BGA at 125 deg C
2. Remove bad solder balls manually using soldering iron with solder wick
3. Place new solder balls
4. Reflow (I'm using hot plate to melt the balls due to limited space, so BGA might experienced sudden change of temperature from room temp to high temp)
5. Inspection
Any feedback would be appreciated. Thanks.
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