When removing/replacing chips. Is it safer to use little to no air flow but higher temp heat or lower heat with more airflow?
My hot air station is a model 852d+ with a max temp setting of 500c and max airflow temp of 8.
I was testing melting a ball of lead free solder with a 4mm tip and at 365c 1 air flow speed it melts in 20 seconds. At 340c 4 air speed it melts same amount of time but not sure if more air speed is dangerous for near by components or components on the underside of the board.
Is the goal to remove chip as quickly as possible or at a slower time? I'm working on small mobile device boards that don't require a preheater.
I've ran into issues before while practicing where components underneath on opposite end of the board suffered from the heat causing shorts under the bgas.
My hot air station is a model 852d+ with a max temp setting of 500c and max airflow temp of 8.
I was testing melting a ball of lead free solder with a 4mm tip and at 365c 1 air flow speed it melts in 20 seconds. At 340c 4 air speed it melts same amount of time but not sure if more air speed is dangerous for near by components or components on the underside of the board.
Is the goal to remove chip as quickly as possible or at a slower time? I'm working on small mobile device boards that don't require a preheater.
I've ran into issues before while practicing where components underneath on opposite end of the board suffered from the heat causing shorts under the bgas.
Comment