Need help to finish my project the world's first portable COF Bounding machine.
my idea is use same theory like hair straightener to make a COF portable Bounding machine.
COF Bounding needs temperature, pressure, and Precise alignment and the most important.....Anisotropic Conductive Film tape...ACF tape which price has been dropping become more affordable.
i try to use two piece flat glasses (glass microscope slides. ) to hold COF TAB in between with spring give the pressure.......but i don't know how to heart up the glasses. i thought to put heating element inside the glasses but at same time they need to be transparent for COF position alignment.....any help would be appreciated
COF bounding ACF tape methods.
Traditional heating method:
3M Anisotropic Conductive Film (ACF) Interconnect Solutions
Bonding Temperature (°C) 195 to 210
Bonding Time (seconds) 10 to 20
Bonding Pressure (MPa) 3 to 5
Ultrasonic vibration method: No one has done this just my imagination.
Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications.
Ultrasonic Solder Ironing Equipment - YES 40Khz100W
https://www.youtube.com/watch?v=OHniu1Fwpwc
Ultrasonic Soldering
https://www.youtube.com/watch?v=B9fbYO79988
or we can use laser to bond COF to screen?
Laser method: No one has done this just my imagination.
BEAUTIFUL! Micro Laser Soldering System - AWESOME! Cool Japan Technology
https://www.youtube.com/watch?v=KnyB9btlhS8
my idea is use same theory like hair straightener to make a COF portable Bounding machine.
COF Bounding needs temperature, pressure, and Precise alignment and the most important.....Anisotropic Conductive Film tape...ACF tape which price has been dropping become more affordable.
i try to use two piece flat glasses (glass microscope slides. ) to hold COF TAB in between with spring give the pressure.......but i don't know how to heart up the glasses. i thought to put heating element inside the glasses but at same time they need to be transparent for COF position alignment.....any help would be appreciated
COF bounding ACF tape methods.
Traditional heating method:
3M Anisotropic Conductive Film (ACF) Interconnect Solutions
Bonding Temperature (°C) 195 to 210
Bonding Time (seconds) 10 to 20
Bonding Pressure (MPa) 3 to 5
Ultrasonic vibration method: No one has done this just my imagination.
Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications.
Ultrasonic Solder Ironing Equipment - YES 40Khz100W
https://www.youtube.com/watch?v=OHniu1Fwpwc
Ultrasonic Soldering
https://www.youtube.com/watch?v=B9fbYO79988
or we can use laser to bond COF to screen?
Laser method: No one has done this just my imagination.
BEAUTIFUL! Micro Laser Soldering System - AWESOME! Cool Japan Technology
https://www.youtube.com/watch?v=KnyB9btlhS8

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