So this is why the computer won't turn on? Are you sure this is the source of the problem? Can I measure it somehow?
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Hp pavilion 14 - No display
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Certainly do wait for feedback from other techs but to me, this IC is defective. It is deformity that is not present on a normal IC and often indicates that a transient went through this device -> caused internal damage to the semiconductor die and the same pressure caused the packaging to bubble up. Also, moisture combined with rapid heat can also cause such micro cracks / bubbles which in the PCB production world is named as 'popcorning'. This is a key reason that parts are gently baked before mounting through SMD ovens and that is to draw out or bake out the moisture.
Can also be caused by reflowing with a hot air tool with too high of a temp and heating of the component at a too high rate. The moisture expands on the inside and as no escape.
What is Popcorn Effect in PCBA Process (pcbonline.com)
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Hi..
That can't be a popcorn effect as there is no BGA die on a substrate, the popcorn name refers i guess to the tin balls that pops out the side glue between substrate and bga die..
to the O.P., scratch it away and see if a hole remains or is only a rosin drop.. byeLast edited by Davi.p; 06-01-2024, 01:29 PM.
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