A hair dryer will not get solder to melting temps!
Unleaded solder generally melts at about 217c and leaded at about 190c.
A proper reflow requires good flux and the proper heat, Then the profiling. The board needs to be heated to about 180 before any heat is applied to the BGA chip... then it has to be bought upto different sets of temperature at the correct speed for certain time periods, Then the cooling is just as important as cooling too quickly or slowly will create weak ass joints
Comment