Re: HP BIOS unlock tool
any help with bios password
HP ELITEBOOK 1050 G1
DA0XW1MBAI1 REV: I
any help with bios password
HP ELITEBOOK 1050 G1
DA0XW1MBAI1 REV: I
Key temps and times for e.g. Winbond 128 SPI: 85°C - max operating temp of SPI chip 150°C - max storage temp of SPI chip ??? - SPI chip max soldering temp "compliant with JEDEC Standard J-STD-20C" 138°C - Melting point of 42/58 tin/bismuth solder eg 'Mechanic V4B45' 183°C - Melting point of 63/37 lead/tin solder 190°C - Melting point of 60/40 standard lead/tin solder 225°C - JEDEC Standard J-STD-20C lowest peak reflow temperature 230°C - Melting point of standard lead-free solder 260°C - JEDEC highest peak reflow temperature Max soldering time at max temp, 30-40s
Key temps and times for e.g. Winbond 128 SPI: 85°C - max operating temp of SPI chip 150°C - max storage temp of SPI chip ??? - SPI chip max soldering temp "compliant with JEDEC Standard J-STD-20C" 138°C - Melting point of 42/58 tin/bismuth solder eg 'Mechanic V4B45' 183°C - Melting point of 63/37 lead/tin solder 190°C - Melting point of 60/40 standard lead/tin solder 225°C - JEDEC Standard J-STD-20C lowest peak reflow temperature 230°C - Melting point of standard lead-free solder 260°C - JEDEC highest peak reflow temperature Max soldering time at max temp, 30-40s
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